Apple’s iPhone 18 Pro offers a redesigned thermal system that’s much larger and much better at dissipating heat generated by the powerful A20 Pro chip.
Apple’s A20 Pro chip utilizes a new packaging method.
The A20 Pro features a six-core CPU with two super cores that are up to 20% faster, along with four efficiency cores. There’s also a seven-core GPU for faster graphics rendering, offering up to a 40% increase in performance over the A19 Pro, along with a dual Neural Engine setup.
Apple has also redesigned the physical package of the silicon for the A20 Pro chip. Custom packaging, inspired by M-series chips, means that the A20 Pro silicon die is located side-by-side with the memory. Apple says this removes the memory from the thermal path of the system-on-chip and allows the chip to be connected directly to the improved vapor chamber.